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Metal Terminal Type High Effective Capacitance & High Allowable Ripple Current
C02E.pdf
Sep.25,2013
KR3 Series
Anti- Deflecting Soldering
noise crack crack
Bonding the metal terminals to external electrodes solves design issues
by mounting large size MLCC!
Features
1
Bond metal terminals to the external electrodes of chips.
The stress applied to the chip is relieved by the elastic action of the metal terminal.
Ceramic
Internal Electrodes
Noise
Board Deflection Cracks
Solder Cracks
Lead-free High Temperature Solder
Metal Terminal
Cracks from mechanical stress to boards and noise
from vibration of the capacitors are design issues.
Reduces stress by the elastic action of the metal terminals!
2
Substantially reduces noise, board deflection cracks and soldering cracks.
This product is not damaged even with a board deflection of 6 mm.
Solder cracks do not occur even with 2,000 cycles of heat stress.
o Comparison of Noise Reduction Effects
o Reduces Stress Caused by Board Deflection
80
60
100
80
Metal Terminal Type
(5750 (in mm)/2220 (in inch)
/630V/220nF)
No damage,
even with 6 mm
board deflection!!
40
Reduced about 30dB!
60
Chip Capacitor
20
40
20
(5750(in mm)/2220(in inch)
/630V/220nF)
0
0
Chip Capacitor
Metal Terminal Type
0.0
1.0
2.0
3.0
4.0
5.0
6.0
Amount of Board Deflection (mm)
Evaluation Items: 5750 (in mm)/2220 (in inch) size/DC630V/220nF
Test Method: DC50V, AC10Vp-p/3kHz
Test Board: Glass Epoxy Board (T: 1.6mm)
Test Quantity: 3pc
Distance Between Microphone and Board: 3mm
Note: Results Using Murata's Evaluation Board
o Suppresses Solder Cracks Caused by Heat Stress
Chip Size
Chip Only
(5750 (in mm)/2220 (in inch) size)
Metal Terminal Type
(5750 (in mm)/2220 (in inch) size)
1000 Cycle
Solder Crack
2000 Cycle
Compared with chips only,
this product is excellent
126
Test Condition: -55 to +125°C, 5min.,(Tank)
Board Used: Glass Epoxy Board (FR-4)
Solder Crack
in solder cracking resistance.
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